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ZIGMA
ZIGMA : Designed to test QFN, DFN, QFP and SO style IC packages for most handler platforms, the Patented Zigma Test Contacting Solution gives you visible results, lowering your cost of test, higher yields, and up-binning of your product.
FEATURES AND BENEFITS
Short DUT pad or leads:
Scrubbing 0.04~0.06mm
Very Small Packages:
0.8x0.8mm
Fine Pitch Devices:
≥0.3mm​​
High Frequency Testing:
27~40 GHz
Sensitive Grounding Testing:
Special Grounding Design Solutions
Thermal Conditioning Channels Technology
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*For illustration purpose only
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