GAMMA™ (US 10,466,300)
Gamma™ : Off-set (IC package and load board ends are not in vertical alignment) High Performance Test Contacting solution for the initial lab characterization through high-volume production test environments.
FEATURES & BENEFITS
Mechanical robustness:
Rated for hundreds of thousands of IC package insertions for high-volume production test environments
Thermal Conditioning Channels (TCC) Technology:
Ability to efficiently thermal condition IC package and test contactor components to maintain ± 2°C test temperature
Versatile and cost effective:
Easy replacement of contacts to reduce MTBA, improving up-time and lowering cost-of-test
Short Wiping Stroke (SWS) Technology:
Micro-wipe provides consistent performance results while minimizing debris generation. Ideal for today's shorter lead geometry configurations
Advance Contact Finish (ACF) Technology:
Extends maintenance intervals by reducing plating transfer buildup and loose debris
