ALPHA™
Alpha™ : Straight-thru (IC package and load board ends are in vertical alignment) High Performance Test Contacting solution for the initial lab characterization through high-volume production test environments.
FEATURES & BENEFITS
Mechanical Robustness:
Rated for hundreds of thousands of IC package insertions for high-volume production test environments
Short Wiping Stroke (SWS) Technology:
Micro-wipe provides consistent performance results while minimizing debris generation. Ideal for today's shorter lead geometry configurations
Versatile and Cost Effective:
Easy replacement of contacts to reduce MTBA, improving up-time and lowering cost-of-test
Advance Contact Finish (ACF) Technology:
Extends maintenance intervals by reducing plating transfer buildup and loose debris
Thermal Conditioning Channels (TCC) Technology:
Ability to efficiently thermal condition IC package and test contactor components to maintain ± 2°C test temperature
