Zigma 2
Zigma™ 2 High Performance Test Contacting solution for the initial lab characterization through high-volume production test environments.
Product:


Zigma™ 2
Patented
products are the next best thing of not having a contact at all. The high electrical performance and long mechanical life ensures reliable repeatable electrical and mechanical performance over multiple cycles.
Zigma™ 2
Patented
Specifications
Designed to test QFN, DFN, QFP, and SO style IC packages for most handler platforms, the Patented Zigma™ Test Contacting Solution gives you visible results, lowering your cost of test, higher yields and up‐ binning of your product.
Electrical Specification
1Electrical Length (mm)2.03
2InductanceSelf (nH)0.44
Mutual (nH)0.03 *
3CapacitanceSelf (pH)0.38
Mutual (pH)0.05 *
4S21 (Insertion Loss/Bandwidth)-1dB @ 14GHz
5S11 (Return Loss/Bandwidth)-20dB @ 3GHz
6S41 (Crosstalk/Bandwidth)-24dB @ 15GHz
7Contact DC Resistance (mohm)<= 25.0
8Current Carrying Capacity (A)4.50
9Current Leakage (pA) @ 10V<= 1.0
10Decoupling Area (mm)1.50
11Peak Current (A @ 1ms)30.00
* Estimated Values

Mechanical Specifications
1Physical Pin Length (mm)2.76
2Pin Uncompressed Height (mm)1.600
3Pin Compliance (mm)0.200
4Pin Tip Coplanarity (mm)0.05
5Pin Wiping Length (mm)<= 0.1
6Gram Force Per Pin (g)55 to 65
7Number Of InsertionHousing>= 6 Millions
Elastomer>= 400K
Pin (Matte Tin)>= 800K
Pin (NiPd)>= 500K
8Operating Temperature ©-45 to 155
9Socket MaterialTORLON 5030
10Pin MaterialBeCu-Ni-Au

Features & Benefits


Superior signal performance: Low insertion loss up to 14GHz. Miniature contacts provide extremely short signal path and improves first‐pass yields
Mechanical robustness: Rated for hundreds of thousands of IC package insertions for high-volume production test environments
Versatile and cost effective: Easy replacement of contacts to reduce MTBA, improving up‐time and lowering cost‐of‐test
Short Wiping Stroke (SWS) Technology: Micro-wipe provides consistent performance results while minimizing debris generation. Ideal for today’s shorter lead geometry configurations
Advance Contact Finish (ACF) Technology: Extends maintenance intervals by reducing plating transfer buildup and loose debris
No “Tail Stop Wear”: Sustainable results for longer periods of time without affecting contact wipe length and extends life of housing for reduced spare part cost
Larger Elastomer: Provides more consistent results, sustainable for longer periods of time and reduction in spare part cost
Load Board Protected from External Debris: Front elastomer acts as a shield, preventing debris and other contaminants from entering contact/load board pad interface

Ground Options Available Based On Testing Needs


Conductive Flat/Solid
  • Material: Copper/Nickel/Gold (BeCu/Ni/Au)
  • Feature:
    • Maximum surface area contact
Conductive Flat with Contacts
  • Material: Copper/Nickel/Gold (BeCu/Ni/Au)
  • Feature:
    • Maximum surface area contact
    • Self-cleaning micro-wipe
    • Vertical compliance
Bell Contact
Patented
  • Material: Copper/Nickel/Gold (BeCu/Ni/Au)
  • Feature:
    • Vertical compliance
Hinged Contact Insert (HCI)
  • Material: Copper/Nickel/Gold (BeCu/Ni/Au)
  • Feature:
    • Self-cleaning micro-wipe
    • Vertical compliance
Non-Conductive Flat with Contacts
  • Material: Torlon 5030 or equivalent
  • Feature:
    • Self-cleaning micro-wipe
    • Vertical compliance



About JF Technology


Since its establishment in 1999, JF Technology has become a global leader in the design and manufacturing of test probes and test sockets for the semiconductor industry. Learn more about our company.