High-Performance Rigid Style
High Performance Test Contacting Solutions designed and validated for initial lab characterization through high-volume production test environments and applicable for leaded and leadless IC package styles.
Higher performing devices in RF, High Speed Digital and Mixed Signal demand high performance test contacting solutions. JF Microtechnology offers high frequency test contacting solutions with nearly transparent effects on your test results, improving yields, up binning and reducing cost of test.

High mechanical life and quick maintenance cycles are also archived with replaceable individual contacts and elastomers giving you reliable, repeatable, electrical and mechanical performance.
Zigma™ 2 – Horizontal Off-Set
(IC package and load board ends)
S21/Insertion Loss rated at -1dB @ 14GHz
Inductance (self) rated at 0.32nH
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Zigma™ 1 – Horizontal Off-Set
(IC package and load board ends)
S21/Insertion Loss rated at -1dB @ 40GHz
Inductance (self) rated at 0.39nH
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Eta.5™ – Horizontal Off-Set
(IC package and load board ends)
S21/Insertion Loss rated at -1dB @ 27GHz
Inductance (self) rated at 0.38nH
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About JF Technology


Since its establishment in 1999, JF Technology has become a global leader in the design and manufacturing of test probes and test sockets for the semiconductor industry. Learn more about our company.