Gamma /
Gamma Kelvin
Gamma™/Gamma™-Kelvin: Off-set (IC package and load board ends are not in vertical alignment) High Performance Test Contacting solution for initial lab characterization through high-volume production test environments.

Gamma™: High current/power test contacting solutions which long mechanical life ensures reliable repeatable electrical and mechanical performance over multiple cycles.
Gamma™ Specifications
Designed to test QFN, DFN, QFP, and SO IC packages for most handler platforms, the Gamma™ Test Contacting Solution gives you visible results, lowering your cost of test, higher yields and up‐ binning of your product.
Electrical Specification
1Electrical Length (mm)12.72, 13.48, 16.68 (GND)
2InductanceSelf (nH)5
Mutual (nH)
3CapacitanceSelf (pH)
Mutual (pH)
4S21 (Insertion Loss/Bandwidth)
5S11 (Return Loss/Bandwidth)
6S41 (Crosstalk/Bandwidth)
7Contact DC Resistance (mohm)<= 30.0
8Current Carrying Capacity (A)4.00
9Current Leakage (pA) @ 10V<= 1.0
10Decoupling Area (mm)
11Peak Current (A @ 1ms)30.00
Mechanical Specifications
1Physical Pin Length (mm)12.72, 13.48, 16.68 (GND)
2Pin Uncompressed Height (mm)5.09, 5.19 (GND)
3Pin Compliance (mm)0.200
4Pin Tip Coplanarity (mm)
5Pin Wiping Length (mm)<= 0.1
6Gram Force Per Pin (g)25 to 30
7Number Of InsertionHousing>= 1 Millions
Pin (Matte Tin)>= 500K
Pin (NiPd)>= 500K
8Operating Temperature ©-60 to 180
9Socket MaterialTORLON 5030
10Pin MaterialBeCu-Ni-Au

Features & Benefits

Mechanical robustness: Rated for hundreds of thousands of IC package insertions for high-volume production test environments
Versatile and cost effective: Easy replacement of contacts to reduce MTBA, improving up-time and lowering cost-of-test
Thermal Conditioning Channels (TCC) Technology: Ability to efficiently thermal condition IC package and test contactor components to maintain ±2°C test temperature
Short Wiping Stroke (SWS) Technology: Micro-wipe provides consistent performance results while minimizing debris generation. Ideal for today’s shorter lead geometry configurations
Advance Contact Finish (ACF) Technology: Extends maintenance intervals by reducing plating transfer buildup and loose debris

Ground Options Available Based On Testing Needs

Conductive Flat/Solid
  • Material: Copper/Nickel/Gold (BeCu/Ni/Au)
  • Feature:
    • Maximum surface area contact
Hinged Contact Insert(HCIE)
  • Material: Copper/Nickel/Gold (BeCu/Ni/Au)
  • Feature:
    • Self-cleaning micro-wipe
    • Vertical compliance
Non-Conductive Flat with Contacts
  • Material: Torlon 5030 or equivalent
  • Feature:
    • Self-cleaning micro-wipe
    • Vertical compliance

About JF Technology

Since its establishment in 1999, JF Technology has become a global leader in the design and manufacturing of test probes and test sockets for the semiconductor industry. Learn more about our company.