Eta.5
Eta.5™ High Performance Test Contacting solution for initial lab characterization through high-volume production test environments.
Product:


Eta.5™ products are the next best thing of not having a contact at all. The high electrical performance and long mechanical life ensures reliable repeatable electrical and mechanical performance over multiple cycles.
Eta.5™ Specifications
Designed to test QFN, DFN, QFP, and SO IC packages for mo st handler platforms, the Eta.5™ Test Contacting Solution gives you visible results, lowering your cost of test, higher yields and up‐ binning of your product.
Electrical Specification
1Electrical Length (mm)0.77
2InductanceSelf (nH)0.38
Mutual (nH)0.095
3CapacitanceSelf (pH)0.14
Mutual (pH)0.049
4S21 (Insertion Loss/Bandwidth)-1dB @ 27GHz
5S11 (Return Loss/Bandwidth)-20dB @ 13GHz
6S41 (Crosstalk/Bandwidth)-20dB @ 13GHz
7Contact DC Resistance (mohm)<= 20.0
8Current Carrying Capacity (A)3.00
9Current Leakage (pA) @ 10V<= 1.0
10Decoupling Area (mm)1.50
11Peak Current (A @ 1ms)20.00
Mechanical Specifications
1Physical Pin Length (mm)0.5
2Pin Uncompressed Height (mm)0.500
3Pin Compliance (mm)0.100
4Pin Tip Coplanarity (mm)0.05
5Pin Wiping Length (mm)0.04 to 0.06
6Gram Force Per Pin (g)15 to 20
7Number Of InsertionHousing>= 6 Millions
Elastomer>= 400K
Pin (Matte Tin)>= 400K
Pin (NiPd)>= 300K
8Operating Temperature ©-45 to 155
9Socket MaterialTORLON 5030
10Pin MaterialBeCu-Ni-Au

Features & Benefits


Superior signal performance: Low insertion loss up to 27GHz. Miniature contacts provide extremely short signal path and improves first‐pass yields
Mechanical robustness: Rated for hundreds of thousands of IC package insertions for high-volume production test environments
Versatile and cost effective: Easy replacement of contacts to reduce MTBA, improving up‐time and lowering cost‐of‐test
Short Wiping Stroke (SWS) Technology: Micro-wipe provides consistent performance results while minimizing debris generation. Ideal for today’s shorter lead geometry configurations
Advance Contact Finish (ACF) Technology: Extends maintenance intervals by reducing plating transfer buildup and loose debris
No “Tail Stop Wear”: Sustainable results for longer periods of time without affecting contact wipe length and extends life of housing for reduced spare part cost

Ground Options Available Based On Testing Needs


Conductive Flat/Solid
  • Material: Copper/Nickel/Gold (BeCu/Ni/Au)
  • Feature:
    • Maximum surface area contact
Conductive Spiked Solid
  • Material: Copper/Nickel/Gold (BeCu/Ni/Au)
  • Feature:
    • Multiple points of contact
Conductive Flat Low Inductance
  • Material: Copper/Nickel/Gold (BeCu/Ni/Au)
  • Feature:
    • Maximum surface area contact
    • Plated thru holes act like via’s to reduce electrical path to load board
Conductive Spiked Solid Low Inductance
  • Material: Copper/Nickel/Gold (BeCu/Ni/Au)
  • Feature:
    • Multiple points of contact
    • Plated thru holes act like via’s to reduce electrical path to load board



About JF Technology


Since its establishment in 1999, JF Technology has become a global leader in the design and manufacturing of test probes and test sockets for the semiconductor industry. Learn more about our company.